This SMT PLCC socket is especially tight. Think going to replace with the through hole version.
Plus, like the gold contacts can get with through hole..
And, there's the holes that might be able to use to push SWaP module out of the socket...
@Rayman said:
Guess final test will be for the hyperram... Have to dig up something for that...
Think @Wuerfel_21 posted an emulator code here, might use that...
Should just be able to use the latest emulators and/or the RAM test program, they all support HyperRAM. For the Winbond one, the latency setting needs to be increased by 1 from the default.
@Wuerfel_21 said:
Okay, datasheets indicate that your Winbond HyperRAM defaults to 7 latency clocks and the ISSI one parallax uses defaults to 6. There's a register that configures this, but roger's init code doesn't seem to have that ability. Now going to brain hurt about how to properly change the values to account for 7 latency (there's also a place where the 6 latency is hardcoded, I think).
Spent a lot of time getting nowhere with Hyperram until found this note. Very glad that you all figured this out long ago...
Got MegaYume running on these new modules. Thinking this is the final test before ready to go out the door...
Also tried MegaYume on one of the modules that was made with the 1.8 V rated Hyperram. Amazingly, that works too. Go figure....
Having a bit of trouble with uSD. Need to troubleshoot some more, but seems flashing with program that flashes LEDs on P58 and P59 is somehow messing up the uSD for FlexProp.
Pretty sure worked perfect before flashed with this test code.
Solution for now is to run FSRW first.
FlexProp's uSD driver works after doing that for some reason...
Comments
Nice and simple solution.
With any luck it should resolve your melting socket issue now, and hopefully consistently.\
Yeah those PLCCs are tight chips to remove - first time around is a little concerning how much force is needed.
This SMT PLCC socket is especially tight. Think going to replace with the through hole version.
Plus, like the gold contacts can get with through hole..
And, there's the holes that might be able to use to push SWaP module out of the socket...
Now have a rig for testing all the P2 pins...
Helped me find a couple hard to spot solder bridges...
Guess final test will be for the hyperram... Have to dig up something for that...
Think @Wuerfel_21 posted an emulator code here, might use that...
Should just be able to use the latest emulators and/or the RAM test program, they all support HyperRAM. For the Winbond one, the latency setting needs to be increased by 1 from the default.
Spent a lot of time getting nowhere with Hyperram until found this note. Very glad that you all figured this out long ago...
Got MegaYume running on these new modules. Thinking this is the final test before ready to go out the door...
Also tried MegaYume on one of the modules that was made with the 1.8 V rated Hyperram. Amazingly, that works too. Go figure....
Having a bit of trouble with uSD. Need to troubleshoot some more, but seems flashing with program that flashes LEDs on P58 and P59 is somehow messing up the uSD for FlexProp.
Pretty sure worked perfect before flashed with this test code.
Solution for now is to run FSRW first.
FlexProp's uSD driver works after doing that for some reason...
Makes me wonder if hyperram is actually binned only by speed and not really voltage.
There’s no way a real 1.8 v part should survive 3.3v , right?
You could be right. Maybe not performance binned but just use a common die with autodetect that selects the pin drive strength accordingly.