This SMT PLCC socket is especially tight. Think going to replace with the through hole version.
Plus, like the gold contacts can get with through hole..
And, there's the holes that might be able to use to push SWaP module out of the socket...
@Rayman said:
Guess final test will be for the hyperram... Have to dig up something for that...
Think @Wuerfel_21 posted an emulator code here, might use that...
Should just be able to use the latest emulators and/or the RAM test program, they all support HyperRAM. For the Winbond one, the latency setting needs to be increased by 1 from the default.
Comments
Nice and simple solution.
With any luck it should resolve your melting socket issue now, and hopefully consistently.\
Yeah those PLCCs are tight chips to remove - first time around is a little concerning how much force is needed.
This SMT PLCC socket is especially tight. Think going to replace with the through hole version.
Plus, like the gold contacts can get with through hole..
And, there's the holes that might be able to use to push SWaP module out of the socket...
Now have a rig for testing all the P2 pins...
Helped me find a couple hard to spot solder bridges...
Guess final test will be for the hyperram... Have to dig up something for that...
Think @Wuerfel_21 posted an emulator code here, might use that...
Should just be able to use the latest emulators and/or the RAM test program, they all support HyperRAM. For the Winbond one, the latency setting needs to be increased by 1 from the default.