Designing for very hot environments
I’m contemplating a P1 design that will be operating basically forever at 80 mhz in a very hot environment with all 8 cores well utilized. The question is do I go with the SMD version or the DIP? There are no tight constraints on board dimensions so either package would work. I can also attach a heatsink or use the metal case, but the enclosure will be tightly sealed so no fans. Which package would work best for heat rejection? I’m leaning toward DIP but I’d like to hear from someone who has maybe already walked this road.