As a semiconductor engineer, typically when you have that many connections to the die, the bond wires become very unrully. It would be very difficult to have a narrow package with that many bond wires in any type of narrow package config.
Also the die gets larger as well and most likely won't sit in a narrow carrier properly. Even 28 pin devices tend to expand in width, like 32's etc etc
I've seen that many connections on a single chip in a .3 inch, but special tooling was required, since the die was actually oriented 45 deg inside the DIP package.· It's not common.
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IC Layout Engineer
Parallax, Inc.
Post Edited (Beau Schwabe (Parallax)) : 12/8/2007 3:27:46 AM GMT
Comments
I'm sure someone will immediately post a picture of some obscure chip to prove me wrong but.....
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Brian
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Also the die gets larger as well and most likely won't sit in a narrow carrier properly. Even 28 pin devices tend to expand in width, like 32's etc etc
The current Propeller die is·almost 6mm square or .42inches ... it would be physically impossible to use a .3 inch dip
kittmaster,
I've seen that many connections on a single chip in a .3 inch, but special tooling was required, since the die was actually oriented 45 deg inside the DIP package.· It's not common.
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Beau Schwabe
IC Layout Engineer
Parallax, Inc.
Post Edited (Beau Schwabe (Parallax)) : 12/8/2007 3:27:46 AM GMT
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