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Using non-DIP IC pacakages on bread boards — Parallax Forums

Using non-DIP IC pacakages on bread boards

Aaqil KhanAaqil Khan Posts: 60
edited 2007-01-24 02:02 in General Discussion
On the development board for my basic stamp, one can only work with DIP packaged ICs. I need a level translator like the LMV339 and its only available in non-DIP. Has anyone used these packages in your designs and how do you work with them (other than soldering thin wires on their tiny leads).
thanks.

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