DIP has to do with the physical 'packaging' of the chip- (ie vs. surface mount)-
The DIP is what you might have heard called 'through hole', designed for soldering by hand to a PCB or plugged into a socket. The surfacemount (generally speaking) is designed for soldering by 'baking' or other means (do a google on surface mount)-
The dip packages also (generally speaking) plug nicely into a breadboard, as they will have a defacto standard spacing to their pins...
Comments
The DIP is what you might have heard called 'through hole', designed for soldering by hand to a PCB or plugged into a socket. The surfacemount (generally speaking) is designed for soldering by 'baking' or other means (do a google on surface mount)-
The dip packages also (generally speaking) plug nicely into a breadboard, as they will have a defacto standard spacing to their pins...
Ryan
The BS2 is a dual in-line package. The BS1 is a SIP....single in-line package.
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トヨタは すばらし です!!