info seek!!

Archiver

Hi All,

I would like to know the packaging Technology involved in the making of a
BASIC STAMP. Is it on a FR4 substrate? Or on a Ceramic substrate(Alumina) ?

Also can some one give me the advantages and disadvantages of using either
of the technologies (FR4 OR CERAMIC) in making a Basic stamp??

Bye
Venu

Archiver

>Hi All,
>
> I would like to know the packaging Technology involved in the making of a
>BASIC STAMP. Is it on a FR4 substrate? Or on a Ceramic substrate(Alumina) ?
>
>Also can some one give me the advantages and disadvantages of using either
>of the technologies (FR4 OR CERAMIC) in making a Basic stamp??
>
>Bye
>Venu

Hi Venu,
I would say, just use FR4 and forget it. Ceramic is expensive and
hard to work with. The main reason for going to these other
materials is (1) to work with extremes of temperature (2) work at
radio frequencies where you need controlled, high dielectric
constant. (3) ultraclean materials for surface leakage suppression.
I may have forgotten something. None of these apply to the stamp
circuit. BTW, sometimes ceramic substrates create very strange
problems. They are piezoelectric, so they generate little voltages
when they vibrate, and in some sensitive circuits that can be fatal.

-- Tracy