Best Lead Solder Paste?
SRLM
Posts: 5,045
I'm looking for some lead solder paste in a jar to use with a stencil. Has anybody compared the various pastes out there and can recommend a good paste?
Comments
-Phil
Haven't had good luck with kester either. Part of the problem is that a lot of paste out there is T3, which is rated for 20 mil pitch and larger.
http://www.digikey.com/product-search/en?WT.z_header=search_go&lang=en&site=us&keywords=SMD291SNL10-ND&formaction=on&x=1&y=9
Phil, I am curious, what concerns make you give Kester the worst rating?
-Phil
Yep. Good stuff.
Thanks everyone for the information. I didn't know about the paste size.
My previous paste was the EP-256 that I purchased in November of last year. I don't know if it was the paste or something else, but when I tried using it in July for a design with the same components as in November I had many more troubles. It might be the paste, it might not, but I think I'll explore the market some.
I don't have the old paste to experiment with anymore: I had to give it away since I moved more than a few hours drive away.
Kester NXG33 - http://www.kester.com/products/product/NXG33-Solder-Paste/
SMTSolderPaste.com - http://www.smtsolderpaste.com/product-info.php?lead-free-no-clean-type4-500g-jar-product-page-pid33.html
ChipQuik - http://www.digikey.com/product-detail/en/SMD291SNL250T5/SMD291SNL250T5-ND/3645044
On the surface the ChipQuik is the best fit: a nice T5 paste. But when I look at the datasheet I see a lack of care there, which makes me think that maybe the same sloppiness is applied to the paste.
Between the Kester and the SMTSolderPaste.com pastes I selected the Kester. I know that Kester seems to be a controversial choice. I selected it because the company seems stable, and they have a nice website. There's probably a better method of determining choice, but I don't know enough about the market and the product to make a more informed decision.
In any case, I'll report back on how it goes. I think I'll need to insulate my oven extra well so that it can more easily reach the 235C temperature requirements.
I got it in a jar from Techni-Tool (source). Do you let the paste sit at room temperature for a few hours before use? After stenciling, do you put the unused paste back in the jar?
If the paste has been out of the jar for less than 30 minutes, I will put it straight back in the jar. Any longer than that, I put it into another jar, but will still re-use it. If you let the paste dry out and put it back into the jar, it will balance out with "wetter paste" in the jar and "freshen up", but over time, repeating that will render the whole jar of paste dryer each time you use. (hopefully that makes sense).
I always "work" the paste before printing boards for parts. I do this by setting up one board with the stencil, and then work the paste back and forth across the stencil a few times to get a really nice bead rolling on my squeegee (which happens to be a plastic putty knife with a very straight edge). I pull that board and and clean it off, clean my stencil apertures, and then start printing boards. Having a worked bead to print with makes a big difference in the quality of the "bricks" of solderpaste lef on the board.
On the Kester website, they have a knowledge base category and if you click on "Solderpaste", there are a few really good PDFs with some standard handling tips.