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Solder SIP to SMT? — Parallax Forums

Solder SIP to SMT?

sunblocksunblock Posts: 55
edited 2013-02-13 00:13 in General Discussion
Since PCB space is a premium, I've started looking at ways to reCap (lol) some of the realestate.
Manufacturers make many combinations of single and multi-capacitor arrays/networks.
Seems like a reasonable approach, except that most viable products are SIP variants.
I'd rather not have to account for holes in the PCB ATT; has anyone ever put down SMT/SMD-style pads and then soldered SIP arrays to them?
Kind of like the TSL237 frequency to light converter's flat 3 pins solder pads I guess?

Comments

  • WBA ConsultingWBA Consulting Posts: 2,934
    edited 2013-02-12 12:05
    Not for production, but for prototypes, yes. The main issue is mechanical stress of the solder joint because most SIPs are tall enough to pose significant angular stress on the solderjoint. As an SMT solution, this could result in pads being ripped off the board if the SIP is bumped. For one of the prototypes I have done, hot-melt glue was added to the base of the SIP to reduce the potential "rip-off". A zig-zag pattern would be much stronger and be self-supported from an angular stress point of view.
  • sunblocksunblock Posts: 55
    edited 2013-02-12 12:13
    WBA Consulting wrote: »
    Not for production, but for prototypes, yes. The main issue is mechanical stress of the solder joint because most SIPs are tall enough to pose significant angular stress on the solderjoint. As an SMT solution, this could result in pads being ripped off the board if the SIP is bumped. For one of the prototypes I have done, hot-melt glue was added to the base of the SIP to reduce the potential "rip-off". A zig-zag pattern would be much stronger and be self-supported from an angular stress point of view.

    I concur with the stress factor, I was thinking more along the lines of lying it down.
    So that the pins are flat against the PCB.
    This would keep the height to that of the thickness of the array.
    The solder area wold be the entire side of the SIP pin
    Thoughts?
  • WBA ConsultingWBA Consulting Posts: 2,934
    edited 2013-02-12 23:53
    In that sort of fashion, I would agree that it could be done easily and with very little mechanical stress. I was under the assumption that real estate was an issue and never thought of laying it down.
  • GadgetmanGadgetman Posts: 2,436
    edited 2013-02-13 00:13
    Lay down the pads in a zig-zag pattern, then bend pins 1, 3, 5 and so on to one side and pins 2, 4, 6 and so on to the other side.
    Make certain the pads are long, though, as you want to bend the pins as close to the 'body' of the SIP as possible, and you want to solder the entire pin to the pad.
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