Whats on the OTHER side of the Prop? Can both sides be hacked off?
Oh wait, you did that in the image above. So then yes... it looks.
Both sides hacked off looks almost exactly the same size as smt prop.
Yes both sides could be hacked, since the die is 7.3mm square, so it fits inside of those middle 4/8 pins (Vss,Boen, Reset, Vdd etc). You could do a 12 pin hack with 1 GPIO pin in each corner, but you'd need to expose some of the top 4 pins to get it booted.
If you hacked both sides it might be better to go for a QFN (9 or 10mm square from memory)
Stop this already. It's barbaric and monstrous and cruel and and ...I don't have words.
Neither does the Prop. The nibbling has left only nibbles.
I have super glued SPI flash onto AVRs before, and got close to using SD cards but always wanted to be able to remove it for checking/programming. I have seen a version of this using bent paper clips. I should of done some experiments on my "9 Volt test" one rather than just singing durges until the early morn.
Perhaps a uSD slot could be molded into the top sheet of plastic
I have made many experimental Prop controllers using Plug Boards. Generally, this requires the use of DIP packaged Props.
Usually I don't need all 32 I/O pins. It would be nice to have a shorter Prop to conserve space, especially on the short Plug Boards.
Personally, I will try this on one of my props.
However, I will chop off only 12 pins so I can still insert the SD-Card from P22 to P25 which results in a DIP-28 package instead of a DIP-24.
Sure, if you are making a PC board it only makes sense to use the smaller package. But I'm an experimenter so the DIP versions work for me.
But in reality, I would think, the die takes a bit more room because of the "Bond Wires". These go between the die and the pin frames.
Duane J
I think the bond wires must be quite compact. The QFN package must have bond wires too, and its 9x9mm external, so still within the "4 pins" (10.16mm) boundary. Actually the exposed pad on the QFN is virtually the same size as the die.
Comments
BTW, I guess Jeff will be your first customer. The only problem is that you will have to sell the chips at half price!
Spot the error? Yeah that would be the wrong pin groups I started attacking. I suspect (hope) it will still work fine.
I was wondering how you were picking up the connection to the removed pins (never having hacked into a chip before), now it's clearly obvious!!
Oh wait, you did that in the image above. So then yes... it looks.
Both sides hacked off looks almost exactly the same size as smt prop.
It's nice solder friendly copper inside !
Yes, the budget takes another hit. I think this is the third one committed to scientific exploration. I'm testing that karma theory...
Yes both sides could be hacked, since the die is 7.3mm square, so it fits inside of those middle 4/8 pins (Vss,Boen, Reset, Vdd etc). You could do a 12 pin hack with 1 GPIO pin in each corner, but you'd need to expose some of the top 4 pins to get it booted.
If you hacked both sides it might be better to go for a QFN (9 or 10mm square from memory)
But in reality, I would think, the die takes a bit more room because of the "Bond Wires". These go between the die and the pin frames.
Duane J
Neither does the Prop. The nibbling has left only nibbles.
I have super glued SPI flash onto AVRs before, and got close to using SD cards but always wanted to be able to remove it for checking/programming. I have seen a version of this using bent paper clips. I should of done some experiments on my "9 Volt test" one rather than just singing durges until the early morn.
Perhaps a uSD slot could be molded into the top sheet of plastic
Usually I don't need all 32 I/O pins. It would be nice to have a shorter Prop to conserve space, especially on the short Plug Boards.
Personally, I will try this on one of my props.
However, I will chop off only 12 pins so I can still insert the SD-Card from P22 to P25 which results in a DIP-28 package instead of a DIP-24.
Sure, if you are making a PC board it only makes sense to use the smaller package. But I'm an experimenter so the DIP versions work for me.
Duane J
I think the bond wires must be quite compact. The QFN package must have bond wires too, and its 9x9mm external, so still within the "4 pins" (10.16mm) boundary. Actually the exposed pad on the QFN is virtually the same size as the die.
Yes but it'll be a QFN with pins. How user friendly is that?
Give me all your money, or the prop gets it. Could this be a new money making venture?