Q: breadboarding effect on timing?
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I'd appreciate if folks with experience with (solderless) breadboarding of prototypes would offer input. I had a project running using a WIZnet WIZ812MJ Ethernet module (very similar to the Spinneret) using the SPI interface. Data throughput was too slow, so I'm now attempting to use the INDIRECT interface, but have been unable to get it to work. It's "missing" values, or they are byte-shifted, etc. I've asked and have been told that many users of the Spinneret are using the INDIRECT interface successfully with the drivers in the OBEX, which I what I'm using. I don't think I have a basic connection/configuration problem as it "almost works".
The area I'm looking at now is skew/delay/load introduced by the 10" jumpers I'm using to get from the WIZnet module to my Propeller Protoboard USB. It's the same method I used to connect using SPI, and the SPI clock was running at about 100nS, which isn't much different than the 70nSec read/write cycle time using INDIRECT. Could it be that the rat's nest of wires all running together now is causing the problem? I've already tried adding nop delays in the PASM code, and it did have an effect, but still not correct.
Thanks.
The area I'm looking at now is skew/delay/load introduced by the 10" jumpers I'm using to get from the WIZnet module to my Propeller Protoboard USB. It's the same method I used to connect using SPI, and the SPI clock was running at about 100nS, which isn't much different than the 70nSec read/write cycle time using INDIRECT. Could it be that the rat's nest of wires all running together now is causing the problem? I've already tried adding nop delays in the PASM code, and it did have an effect, but still not correct.
Thanks.
Comments
I've properly soldered the WIZnet module onto my Protoboard, used short (<2") jumpers and it works fine now. Time to see what kind of speed I can squeeze out of the additional 10 pins I've just dedicated (compared to SPI).
Thanks for the comments.
http://www.electro-tech-online.com/general-electronics-chat/86506-fm-transmitter.html
quote from the thread:
"I measured my solderless breadboards and I find that each row has 3.3pF of capacitance to the next row. Not only that, but from each row to each alternate (second one over) row has 1.7pF and to each second alternate there is 1.2pF. And so on it goes."
"PS: for those interested in this subject, I find that there is also an awful lot of capacitance from each row to the two buses at the top and bottom of the board. For example, from one row to the nearest bus, I measure 1.3 to 1.6 pF. This is even though they are not parallel to each other. From one row to the second nearest bus, there is also 1.3 pF."
I'm posting this update in the hope that others that are be battling a similar situation might learn from what I've learned - the hard way.
Thanks for the reply.