this would be cool
Lee Marshall
Posts: 106
how about a special edition prop in a clear package, like this:
uk.farnell.com/1242265/optoelectronics/product.us0?sku=TAOS-TSL1401R
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I hear and I forget. I see and I remember. I do and I understand
-Confucius
uk.farnell.com/1242265/optoelectronics/product.us0?sku=TAOS-TSL1401R
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I hear and I forget. I see and I remember. I do and I understand
-Confucius
Comments
-Phil
In the late '70s I had the fortune to be involved with a design which was a hybrid of several packages (metal 'can' sort of like crystal oscillators, but with some 2 dozen pins; ceramic substrate of gold traces for connects, chips were in die form, wire bonded).
But prior to solder sealing the lid, they had to be checked out and debugged. This required working under a microscope; the package could be almost hidden under a man's thumb. Well, to see where to probe you needed a high intensity lamp. I eventually learned that the light would have to be turned off while scoping the signals (analog) because the 741 chip amplifiers wouldn't work properly under light. Tough way to debug. But a good learning experience. Phil isn't BS'ing, for sure. You don't want clear packaging on ICs.
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Harley Shanko