The older I become, the more I realize how much I don't know - so I thought I'd ask the Forum...
I've a project that uses the SSOP BS2 interpreter chip. The project was verified using a BS2 module and now it's time to drop in the smaller parts. Problem is that I do not have the tools to solder SSOP devices (after a miserable attempt with my usual), and that's the question being posed.
What do I use? I was thinking about a solder paste syringe to apply the solder and then a hot air gun to melt the solder. I do not want to go the oven route, thank you - unless there is overwhelming reason to do so.
Having the BS2/SSOP becoming too hot is always a concern; definitely a concern.
So, please, share with me some wisdom!
Well-written documentation requires no explanation.