January 1995 ADC0831/ADC0832/ADC0834 and ADC0838 8-Bit Serial I/O A/D Converters with Multiplexer Options General Description The ADC0831 series are 8-bit successive approximation A/D converters with a serial I/O and configurable input multiplexers with up to 8 channels. The serial I/O is configured to comply with the NSC MICROWIRETM serial data exchange standard for easy interface to the COPSTM family of processors, and can interface with standard shift registers or mPs. The 2-, 4-or 8-channel multiplexers are software configured for single-ended or differential inputs as well as channel assignment. The differential analog voltage input allows increasing the common-mode rejection and offsetting the analog zero input voltage value. In addition, the voltage reference input can be adjusted to allow encoding any smaller analog voltage span to the full 8 bits of resolution. Features Y NSC MICROWIRE compatibleÐdirect interface to COPS family processors Y Easy interface to all microprocessors, or operates ``stand-alone'' Y Operates ratiometrically or with 5 VDC voltage reference Y No zero or full-scale adjust required Y 2-, 4-or 8-channel multiplexer options with address logic Y Shunt regulator allows operation with high voltage supplies Y 0V to 5V input range with single 5V power supply Y Remote operation with serial digital data link Y TTL/MOS input/output compatible Y 0.3× standard width, 8-, 14-or 20-pin DIP package Y 20 Pin Molded Chip Carrier Package (ADC0838 only) Y Surface-Mount Package Key Specifications Y Resolution 8 Bits Y Total Unadjusted Error g(/2 LSB and g1 LSB Y Single Supply 5 VDC Y Low Power 15 mW Y Conversion Time 32 ms Typical Application ADC0831/ADC0832/ADC0834andADC0838 8-Bit SerialI/OA/DConverterswith MultiplexerOptions TL/H/5583 ± 1 TRI-STATEÉis a registered trademark of National Semiconductor Corporation. COPSTM and MICROWIRETM are trademarks of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/H/5583 RRD-B30M115/Printed in U. S. A. Absolute Maximum Ratings (Notes1&2) If Military/Aerospace specified devices are required, Lead Temperature (Soldering 10 sec.) please contact the National Semiconductor Sales Dual-In-Line Package (Plastic) 260§C Office/Distributors for availability and specifications. Dual-In-Line Package (Ceramic) 300§C Current intoV a(Note 3) 15 mA Molded Chip Carrier Package Vapor Phase (60 sec.) 215§C Supply Voltage,VCC (Note3) 6.5V Infrared (15 sec.) 220§C Voltage ESD Susceptibility (Note 5) 2000V Logic Inputs b0.3V toVCC a0.3V Analog Inputs b0.3V toVCC a0.3V Operating Ratings (Notes1&2) Input Current per Pin (Note 4) g5mA Package g20 mA Supply Voltage, VCC 4.5 VDC to 6.3 VDC Storage Temperature b65§Cto a150§C Temperature Range TMINsTAsTMAX ADC0831/8BCJ, Package Dissipation at TAe25§C(Board Mount) 0.8W ADC0831/4/8CCJ, ADC0832BIWM, ADC0831/2/4/8CIWM b40§Cto a85§C ADC0831/2//4/8BCN, ADC0838BCV, ADC0831/2/4/8CCN, ADC0838CCV, ADC0831/2/4/8CCWM 0§Cto a70§C Converter and Multiplexer Electrical Characteristics The following specifications apply for VCC eVaeVREF e5V, VREF sVCC a0.1V, TA eTj e25§C, and fCLK e250 kHz unless otherwise specified. Boldface limits apply from TMIN to TMAX. Parameter Conditions BCJ, BIWM, CIWM and CCJ Devices BCV, CCV, CCWM, BCN and CCN Devices Units Typ (Note 12) Tested Limit (Note 13) Design Limit (Note 14) Typ (Note 12) Tested Limit (Note 13) Design Limit (Note 14) CONVERTER AND MULTIPLEXER CHARACTERISTICS Total Unadjusted Error ADC0838BCV ADC0831/2/4/8BCN ADC0831/8BCJ ADC0832BIWM ADC0838CCV ADC0831/2/4/8CCN ADC0831/2/4/8CCWM ADC0831/4/8CCJ ADC0831/2/4/8CIWM VREFe5.00 V (Note 6) g(/2 g(/2 g1 g1 g(/2 g(/2 g1 g1 g1 g(/2 g(/2 g1 g1 g1 LSB Minimum Reference Input Resistance (Note 7) 3.5 1.3 3.5 1.3 1.3 kX Maximum Reference Input Resistance (Note 7) 3.5 5.9 3.5 5.4 5.9 kX Maximum Common-Mode Input Range (Note 8) VCC a0.05 VCC a0.05 VCCa0.05 V Minimum Common-Mode Input Range (Note 8) GND b0.05 GND b0.05 GNDb0.05 V DC Common-Mode Error g(/16 g(/4 g(/16 g(/4 g(/4 LSB 2 Converter and Multiplexer Electrical Characteristics (Continued) The following specifications apply for VCC e Vae 5V, TA e Tj e 25§C, and fCLK e 250 kHz unless otherwise specified. Boldface limits apply from TMIN to TMAX. Parameter Conditions BCJ, BIWM, CIWM and CCJ Devices BCV, CCV, CCWM, BCN and CCN Devices Units Typ (Note 12) Tested Limit (Note 13) Design Limit (Note 14) Typ (Note 12) Tested Limit (Note 13) Design Limit (Note 14) CONVERTER AND MULTIPLEXER CHARACTERISTICS (Continued) Change in zero 15 mA into Va error from VCCe5V VCCeN.C. to internal zener VREFe5V operation (Note 3) 1 1 1 LSB VZ, internal MIN 15 mA into Va 6.3 6.3 6.3 diode breakdown MAX 8.5 8.5 8.5 V (at Va)(Note 3) Power Supply Sensitivity VCCe5Vg5% g(/16 g(/4 g(/4 g(/16 g(/4 g(/4 LSB IOFF, Off Channel Leakage On Channele5V, b0.2 b0.2 b1 mA Current (Note 9) Off Channele0V b1 On Channele0V, Off Channele5V a0.2 a1 a0.2 a1 mA ION,On Channel Leakage On Channele0V, b0.2 b0.2 b1 mA Current (Note 9) Off Channele5V b1 On Channele5V, Off Channele0V a0.2 a1 a0.2 a1 mA DIGITAL AND DC CHARACTERISTICS VIN(1),Logical ``1'' Input Voltage (Min) VCCe5.25V 2.0 2.0 2.0 V VIN(0),Logical ``0'' Input Voltage (Max) VCCe4.75V 0.8 0.8 0.8 V IIN(1), Logical ``1'' Input Current (Max) VINe5.0V 0.005 1 0.005 1 1 mA IIN(0), Logical ``0'' Input Current (Max) VINe0V b0.005 b1 b0.005 b1 b1 mA VOUT(1),Logical ``1'' Output VCCe4.75V Voltage (Min) IOUTeb360 mA 2.4 2.4 2.4 V IOUTeb10 mA 4.5 4.5 4.5 V VOUT(0),Logical ``0'' Output Voltage (Max) VCCe4.75V IOUTe1.6 mA 0.4 0.4 0.4 V IOUT,TRI-STATE Output VOUTe0V b0.1 b3 b0.1 b3 b3 mA Current (Max) VOUTe5V 0.1 3 0.1 a3 a3 mA ISOURCE,Output Source Current (Min) VOUTe0V b14 b6.5 b14 b7.5 b6.5 mA ISINK, Output Sink Current (Min) VOUTeVCC 16 8.0 16 9.0 8.0 mA ICC,Supply Current (Max) ADC0831, ADC0834, 0.9 2.5 0.9 2.5 2.5 mA ADC0838 ADC0832 Includes Ladder Current 2.3 6.5 2.3 6.5 6.5 mA 3 AC Characteristics The following specifications apply for VCC e 5V, tr e tf e 20 ns and25§C unless otherwise specified. Parameter Conditions Typ (Note 12) Tested Limit (Note 13) Design Limit (Note 14) Limit Units fCLK, Clock Frequency Min Max 10 400 kHz kHz tC,Conversion Time Not including MUX Addressing Time 8 1/fCLK Clock Duty Cycle (Note 10) Min Max 40 60 % % tSET-UP,CS Falling Edge or Data Input Valid to CLK Rising Edge 250 ns tHOLD, Data Input Valid after CLK Rising Edge 90 ns tpd1,tpd0ÐCLK Falling Edge to Output Data Valid (Note 11) CLe100 pF Data MSB First Data LSB First 650 250 1500 600 ns ns t1H,t0H,ÐRising Edge of CS to Data Output and CLe10 pF, RLe10k (see TRI-STATEÉTest Circuits) 125 250 ns SARS Hi ± Z CLe100 pf, RLe2k 500 ns CIN, Capacitance of Logic Input 5 pF COUT, Capacitance of Logic Outputs 5 pF Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions. Note 2: All voltages are measured with respect to the ground plugs. Note 3: Internal zener diodes (6.3 to 8.5V) are connected fromV a to GND and VCC to GND. The zener at Va can operate as a shunt regulator and is connected toVCC viaa conventional diode. Since the zener voltage equalsthe A/D's breakdown voltage, the diode insures thatVCC willbe below breakdown when the device is powered from Va. Functionality is therefore guaranteed for Va operation even though the resultant voltage at VCC may exceed the specified Absolute Max of 6.5V. It is recommended that a resistor be used to limit the max current into Va. (SeeFigure 3 in Functional Description Section 6.0) Note 4: When the input voltage (VIN)at any pin exceeds the power supply rails (VIN k Vb or VIN l Va)the absolute value of current at that pin should be limited to 5 mA or less. The 20 mA package input current limits the number of pins that can exceed the power supply boundaries witha5mA current limit to four. Note 5: Human body model, 100 pF discharged through a 1.5 kX resistor. Note 6: Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors. Note 7: Cannot be tested for ADC0832. Note 8: For VIN(b)tVIN(a)the digital output code will be 0000 0000. Two on-chip diodes are tied to each analog input (see Block Diagram) which will forward conduct for analog input voltages one diode drop below ground or one diode drop greater then the VCC supply. Be careful, during testing at low VCC levels (4.5V), as high level analog inputs (5V) can cause this input diode to conductÐespecially at elevated temperatures, and cause errors for analog inputs near full-scale. The spec allows 50 mV forward bias of either diode. This means that as long as the analog VIN or VREF does not exceed the supply voltage by more than 50 mV, the output code will be correct. To achieve an absolute 0 VDC to5VDC input voltage range will therefore require a minimum supply voltage of 4.950 VDC over temperature variations, initial tolerance and loading. Note 9: Leakage current is measured with the clock not switching. Note 10: A 40% to 60% clock duty cycle range insures proper operation at all clock frequencies. In the case that an available clock has a duty cycle outside of these limits, the minimum, time the clock is high or the minimum time the clock is low must be at least1 ms. The maximum time the clock can be high is 60 ms. The clock can be stopped when low so long as the analog input voltage remains stable. Note 11: Since data, MSB first, is the output of the comparator used in the successive approximation loop, an additional delay is built in (see Block Diagram) to allow for comparator response time. Note 12: Typicals are at 25§C and represent most likely parametric norm. Note 13: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level). Note 14: Guaranteed but not 100% production tested. These limits are not used to calculate outgoing quality levels. 4 Typical Performance Characteristics Unadjusted Offset Error Linearity Error vsVREF Linearity Error vs vsVREF Voltage Voltage Temperature TL/H/5583 ± 2 Power Supply Current vs Temperature (ADC0838, Output Current vs Linearity Error vs fCLK ADC0831, ADC0834) Temperature Note: For ADC0832 addIREF. TL/H/5583 ±40 Power Supply Current vsfCLK Leakage Current Test Circuit TL/H/5583 ±29 TL/H/5583 ±3 5 TRI-STATE Test Circuits and Waveforms t1H t1H t0H t0H TL/H/5583 ±4 TL/H/5583 ±23 Timing Diagrams Data Input Timing Data Output Timing TL/H/5583 ±24 TL/H/5583 ±25 ADC0831 Start Conversion Timing TL/H/5583 ±26 6 Timing Diagrams (Continued) ADC0831 Timing TL/H/5583 ±27 *LSB first output not available on ADC0831. ADC0832 Timing TL/H/5583 ±28 ADC0834 Timing TL/H/5583 ±5 7 Timing Diagrams (Continued) ADC0838Timing TL/H/5583±6 * Make sure clock edge Ý18 clocks in the LSB before SE is taken low TL/H/5583±6 * Make sure clock edge Ý18 clocks in the LSB before SE is taken low 8 ADC0838 Functional Block Diagram TL/H/5583±7 *Some of these functions/pins are not available with other options. Note 1: For the ADC0834, D1 is input directly to the D input of SELECT 1. SELECT 0 is forced to a ``1''. For the ADC0832, DI is input directly to the DI input of ODD/SIGN. SELECT 0 is forced to a ``0'' and SELECT 1 is forced to a ``1''. TL/H/5583±7 *Some of these functions/pins are not available with other options. Note 1: For the ADC0834, D1 is input directly to the D input of SELECT 1. SELECT 0 is forced to a ``1''. For the ADC0832, DI is input directly to the DI input of ODD/SIGN. SELECT 0 is forced to a ``0'' and SELECT 1 is forced to a ``1''. 9 Connection Diagrams ADC0838 8-Channel MUX ADC0834 4-Channel MUX Small Outline/Dual-In-Line Package(J,MandN) Small Outline/Dual-In-Line Package(J,M,andN) TL/H/5583 ±30 Top View COM internally connected toAGND TL/H/5583 ±31 Top View COM internally connected to GND. VREF internally connected to VCC. TL/H/5583 ±8 Top View ADC0832 2-Channel MUX ADC0832 2-Channel MUX ADC0831 Single Differential Input Dual-In-Line Package (J and N) Small Outline Package (M) Dual-In-Line Package (J and N) ADC0831 Single Differential Input ADC0838 8-Channel MUX Small Outline Package (M) Molded Chip Carrier (PCC) Package (V) TL/H/5583 ±41 Top View TL/H/5583 ±32 Top View TL/H/5583 ±42 Top View 10 TL/H/5583 ±33 Functional Description 1.0 MULTIPLEXER ADDRESSING The design of these converters utilizes a sample-data com-tial. In the differential case, it also assigns the polarity of the parator structure which provides for a differential analog in-channels. Differential inputs are restricted to adjacent chanput to be converted by a successive approximation routine. nel pairs. For example channel 0 and channel 1 may be The actual voltage converted is always the difference be- selected as a different pair but channel 0 or 1 cannot act tween an assigned `` a'' input terminal and a ``b'' input ter differentially with any other channel. In addition to selecting minal. The polarity of each input terminal of the pair being differential mode the sign may also be selected. Channel 0 converted indicates which line the converter expects to be may be selected as the positive input and channel 1 as the the most positive. If the assigned `` a'' input is less than the negative input or vice versa. This programmability is best ``b'' input the converter responds with an all zeros output illustrated by the MUX addressing codes shown in the folcode. lowing tables for the various product options. A unique input multiplexing scheme has been utilized to pro- The MUX address is shifted into the converter via the DI vide multiple analog channels with software-configurable line. Because the ADC0831 contains only one differential single-ended, differential, or a new pseudo-differential op input channel with a fixed polarity assignment, it does not tion which will convert the difference between the voltage at require addressing. any analog input and a common terminal. The analog signal The common input line on the ADC0838 can be used as a conditioning required in transducer-based data acquisition pseudo-differential input. In this mode, the voltage on this systems is significantly simplified with this type of input flexi-pin is treated as the ``b'' input for any of the other input bility. One converter package can now handle ground refer-channels. This voltage does not have to be analog ground; enced inputs and true differential inputs as well as signals it can be any reference potential which is common to all of with some arbitrary reference voltage. the inputs. This feature is most useful in single-supply appli- A particular input configuration is assigned during the MUX cation where the analog circuitry may be biased up to a addressing sequence, prior to the start of a conversion. The potential other than ground and the output signals are all MUX address selects which of the analog inputs are to be referred to this potential. enabled and whether this input is single-ended or differen- TABLE I. Multiplexer/Package Options Part Number of Analog Channels Number of Package Pins Number Single-Ended Differential ADC0831 1 1 8 ADC0832 2 1 8 ADC0834 4 2 14 ADC0838 8 4 20 11 Functional Description (Continued) TABLE II. MUX Addressing: ADC0838 Single-Ended MUX Mode MUX Address Analog Single-Ended Channel Ý SGL/ DIF ODD/ SIGN SELECT 1 0 0 1 2 3 4 5 6 7 COM 1 0 0 0 a b 1 0 0 1 a b 1 0 1 0 a b 1 0 1 1 a b 1 1 0 0 a b 1 1 0 1 a b 1 1 1 0 a b 1 1 1 1 a b Differential MUX Mode MUX Address Analog Differential Channel-Pair Ý SGL/ DIF ODD/ SIGN SELECT 0 1 2 3 1 0 0 1 2 3 4 5 6 7 0 0 0 0 a b 0 0 0 1 a b 0 0 1 0 a b 0 0 1 1 a b 0 1 0 0 b a 0 1 0 1 b a 0 1 1 0 b a 0 1 1 1 b a TABLE III. MUX Addressing: ADC0834 TABLE IV. MUX Addressing: Single-Ended MUX Mode ADC0832 MUX Address Channel Ý SGL/ DIF ODD/ SIGN SELECT 0 1 2 31 1 0 0 a 1 0 1 a 1 1 0 a 1 1 1 a Single-Ended MUX Mode MUX Address Channel Ý SGL/ DIF ODD/ SIGN 0 1 1 0 a 1 1 a COM is internally tied toAGND COM is internally tied toA GND Differential MUX Mode Differential MUX Mode MUX Address Channel Ý SGL/ DIF ODD/ SIGN SELECT 0 1 2 31 0 0 0 a b 0 0 1 a b 0 1 0 b a 0 1 1 b a MUX Address Channel Ý SGL/ DIF ODD/ SIGN 0 1 0 0 a b 0 1 b a 12 Functional Description (Continued) Since the input configuration is under software control, it can be modified, as required, at each conversion.A channel can be treated as a single-ended, ground referenced input for one conversion; then it can be reconfigured as part of a differential channel for another conversion. Figure 1 illustrates the input flexibility which can be achieved. The analog input voltages for each channel can range from 50 mV below ground to 50 mV above VCC (typically 5V) without degrading conversion accuracy. 2.0 THE DIGITAL INTERFACE A most important characteristic of these converters is their serial data link with the controlling processor. Using a serial communication format offers two very significant system improvements; it allows more function to be included in the converter package with no increase in package size and it can eliminate the transmission of low level analog signals by locating the converter right at the analog sensor; transmitting highly noise immune digital data back to the host processor. 8 Single-Ended 4 Differential To understand the operation of these converters it is best to refer to the Timing Diagrams and Functional Block Diagram and to follow a complete conversion sequence. For clarity a separate diagram is shown of each device. 1. A conversion is initiated by first pulling the CS (chip select) line low. This line must be held low for the entire conversion. The converter is now waiting for a start bit and its MUX assignment word. 2. A clock is then generated by the processor (if not provid ed continuously) and output to the A/D clock input. 3. On each rising edge of the clock the status of the data in (DI) line is clocked into the MUX address shift register. The start bit is the first logic ``1'' that appears on this line (all leading zeros are ignored). Following the start bit the converter expects the next 2 to 4 bits to be the MUX assignment word. 8 Pseudo-Differential Mixed Mode TL/H/5583 ±9 FIGURE 1. Analog Input Multiplexer Options for the ADC0838 13 Functional Description (Continued) 4. When the start bit has been shifted into the start location of the MUX register, the input channel has been assigned and a conversion is about to begin. An interval of (/2 clock period (where nothing happens) is automatically inserted to allow the selected MUX channel to settle. The SAR status line goes high at this time to signal that a conversion is now in progress and the DI line is disabled (it no longer accepts data). 5. The data out (DO) line now comes out of TRI-STATE and provides a leading zero for this one clock period of MUX settling time. 6. When the conversion begins, the output of the SAR comparator, which indicates whether the analog input is greater than (high) or less than (low) each successive voltage from the internal resistor ladder, appears at the DO line on each falling edge of the clock. This data is the result of the conversion being shifted out (with the MSB coming first) and can be read by the processor immediately. 7. After 8 clock periods the conversion is completed. The SAR status line returns low to indicate this (/2 clock cycle later. 8. If the programmer prefers, the data can be provided in an LSB first format [this makes use of the shift enable (SE) control line]. All 8 bits of the result are stored in an output shift register. On devices which do not include the SE control line, the data, LSB first, is automatically shifted out the DO line, after the MSB first data stream. The DO line then goes low and stays low until CS is returned high. On the ADC0838 the SE line is brought out and if held high, the value of the LSB remains valid on the DO line. When SE is forced low, the data is then clocked out LSB first. The ADC0831 is an exception in that its data is only output in MSB first format. 9. All internal registers are cleared when the CS line is high. If another conversion is desired, CS must make a high to low transition followed by address information. The DI and DO lines can be tied together and controlled through a bidirectional processor I/O bit with one wire. This is possible because the DI input is only ``looked-at'' during the MUX addressing interval while the DO line is still in a high impedance state. 3.0 REFERENCE CONSIDERATIONS The voltage applied to the reference input to these converters defines the voltage span of the analog input (the difference between over which the 256 VIN(MAX) and VIN(MIN)) possible output codes apply. The devices can be used in either ratiometric applications or in systems requiring absolute accuracy. The reference pin must be connected to a voltage source capable of driving the reference input resistance of typically 3.5 kX. This pin is the top of a resistor divider string used for the successive approximation conversion. In a ratiometric system, the analog input voltage is proportional to the voltage used for the A/D reference. This voltage is typically the system power supply, so the VREF pin can be tied to VCC (done internally on the ADC0832). This technique relaxes the stability requirements of the system reference as the analog input and A/D reference move together maintaining the same output code for a given input condition. For absolute accuracy, where the analog input varies between very specific voltage limits, the reference pin can be biased with a time and temperature stable voltage source. The LM385 and LM336 reference diodes are good low current devices to use with these converters. The maximum value of the reference is limited to the VCC supply voltage. The minimum value, however, can be quite small (see Typical Performance Characteristics) to allow direct conversions of transducer outputs providing less than a 5V output span. Particular care must be taken with regard to noise pickup, circuit layout and system error voltage sources when operating with a reduced span due to the increased sensitivity of the converter (1 LSB equals VREF/ 256). TL/H/5583 ±10 a) Ratiometric b) Absolute with a Reduced Span FIGURE 2. Reference Examples 14 Functional Description (Continued) 4.0 THE ANALOG INPUTS 5.2 Full-Scale The most important feature of these converters is that they The full-scale adjustment can be made by applying a differ- can be located right at the analog signal source and through ential input voltage which is1 (/2 LSB down from the desired just a few wires can communicate with a controlling proces-analog full-scale voltage range and then adjusting the magsor with a highly noise immune serial bit stream. This in itself nitude of the VREF input (or VCC for the ADC0832) for a greatly minimizes circuitry to maintain analog signal accura-digital output code which is just changing from 1111 1110 to cy which otherwise is most susceptible to noise pickup. 1111 1111. However, a few words are in order with regard to the analog 5.3 Adjusting for an Arbitrary Analog Input Voltage inputs should the input be noisy to begin with or possibly Range riding on a large common-mode voltage. If the analog zero voltage of the A/D is shifted away from The differential input of these converters actually reduces ground (for example, to accommodate an analog input sig the effects of common-mode input noise, a signal common nal which does not go to ground), this new zero reference to both selected `` a'' and ``b'' inputs for a conversion (60 should be properly adjusted first. AVIN(a) voltage which Hz is most typical). The time interval between sampling the .J #J equals this desired zero reference plus (/2 LSB (where the `` a'' input and then the ``b'' input is (/2 of a clock period. LSB is calculated for the desired analog span, using The change in the common-mode voltage during this short 1 LSBe analog span/256) is applied to selected `` a'' input time interval can cause conversion errors. For a sinusoidal and the zero reference voltage at the corresponding ``b'' common-mode signal this error is: input should then be adjusted to just obtain the 00HEX to 0.5 Ð( 01HEX code transition. (max)e VPEAK(2qfCM) Verror fCLK The full-scale adjustment should be made [with the proper where fCM is the frequency of the common-mode signal, VIN(b) voltage applied] by forcing a voltage to the VIN(a) input which is given by: VPEAK is its peak voltage value and fCLK, is the A/D clock frequency. (VMAXbVMIN) VIN(a)fsadj e VMAXb1.5 For a 60 Hz common-mode signal to generate a (/4 LSB 256 error (&5 mV) with the converter running at 250 kHz, its where: peak value would have to be 6.63V which would be larger e the high end of the analog input range than allowed as it exceeds the maximum analog input limits. VMAX and Due to the sampling nature of the analog inputs short spikes VMIN e the low end (the offset zero) of the analog of current enter the `` a'' input and exit the ``b'' input at the range. clock edges during the actual conversion. These currents decay rapidly and do not cause errors as the internal com (Both are ground referenced.) parator is strobed at the end of a clock period. Bypass ca-The VREF (or VCC) voltage is then adjusted to provide a pacitors at the inputs will average these currents and cause code change from FEHEX to FFHEX. This completes the ad- an effective DC current to flow through the output resist-justment procedure. ance of the analog signal source. Bypass capacitors should 6.0 POWER SUPPLY not be used if the source resistance is greater than 1 kX. A unique feature of the ADC0838 and ADC0834 is the inclu- This source resistance limitation is important with regard to sion of a zener diode connected from the Va terminal to the DC leakage currents of input multiplexer as well. The ground which also connects to the VCC terminal (which is worst-case leakage current of g1 mA over temperature will the actual converter supply) through a silicon diode, as createa1mV input error witha1kX source resistance. An shown in Figure 3 . (See Note 3) op amp RC active low pass filter can provide both impedance buffering and noise filtering should a high impedance signal source be required. 5.0 OPTIONAL ADJUSTMENTS 5.1 Zero Error The zero of the A/D does not require adjustment. If the minimum analog input voltage value, VIN(MIN), is not ground a zero offset can be done. The converter can be made to output 0000 0000 digital code for this minimum input voltage by biasing any VIN (b) input at this VIN(MIN) value. This utilizes the differential mode operation of the A/D. The zero error of the A/D converter relates to the location of the first riser of the transfer function and can be measured by grounding the VIN(b) input and applying a small TL/H/5583 ±11 magnitude positive voltage to theVIN(a)input. Zero error is FIGURE 3. An On-Chip Shunt Regulator Diode the difference between the actual DC input voltage which is necessary to just cause an output digital code transition from 0000 0000 to 0000 0001 and the ideal (/2 LSB value ((/2 LSBe9.8 mV for VREFe5.000 VDC). 15 TL/H/5583 ±12 FIGURE 4. Operating with a Temperature Compensated Reference TL/H/5583 ±34 FIGURE 5. Using the A/D as the System Supply Regulator *Note: 4.5V s VCC s 6.3V TL/H/5583 ±35 FIGURE 6. GeneratingVCC from the Converter Clock TL/H/5583 ±36 FIGURE 7. Remote SensingÐ Clock and Power on1Wire 16 Functional Description (Continued) This zener is intended for use as a shunt voltage regulator to eliminate the need for any additional regulating components. This is most desirable if the converter is to be remotely located from the system power source. Figures 4 and 5 illustrate two useful applications of this on-board zener when an external transistor can be afforded. An important use of the interconnecting diode between Va and VCC is shown in Figures 6 and 7. Here, this diode is used as a rectifier to allow the VCC supply for the converter Applications to be derived from the clock. The low current requirements of the A/D and the relatively high clock frequencies used (typically in the range of 10k±400 kHz) allows using the small value filter capacitor shown to keep the ripple on the VCC line to well under (/4 of an LSB. The shunt zener regulator can also be used in this mode. This requires a clock voltage swing which is in excess ofVZ.A current limit for the zener is needed, either built into the clock generator or a resistor can be used from the CLK pin to the Va pin. Applications (Continued) Digital Link and Sample Controlling Software for the Serially Oriented COP420 and the Bit Programmable I/O INS8048 COP CODING EXAMPLE Mnemonic Instruction LEI ENABLES SIO's INPUT AND OUTPUT SC C e 1 OGI G0e0(CSe0) CLR A CLEARS ACCUMULATOR AISC 1 LOADS ACCUMULATOR WITH 1 XAS EXCHANGES SIO WITH ACCUMULATOR AND STARTS SK CLOCK LDD LOADS MUX ADDRESS FROM RAM INTO ACCUMULATOR NOP Ð XAS LOADS MUX ADDRESS FROM ACCUMULATOR TO SIO REGISTER u 8 INSTRUCTIONS v XAS READS HIGH ORDER NIBBLE (4 BITS) INTO ACCUMULATOR XIS PUTS HIGH ORDER NIBBLE INTO RAM CLRA CLEARS ACCUMULATOR RC C e 0 XAS READS LOW ORDER NIBBLE INTO ACCUMULATOR AND STOPS SK XIS PUTS LOW ORDER NIBBLE INTO RAM OGI G0e1(CSe1) LEI DISABLES SIO's INPUT AND OUTPUT 8048 CODING EXAMPLE Mnemonic START: ANL P1, Ý0F7H MOV B, Ý5 MOV A, ÝADDR LOOP 1: RRC A JC ONE ZERO: ANL P1, Ý0FEH JMP CONT ONE: ORL P1, Ý1 CONT: CALL PULSE DJNZ B, LOOP 1 CALL PULSE MOV B, Ý8 LOOP 2: CALL PULSE IN A, P1 RRC A RRC A MOV A, C RLC A MOV C, A DJNZ B, LOOP 2 RETR PULSE: ORL P1, Ý04 NOP ANL P1, Ý0FBH RET TL/H/5583 ±13 Instruction ;SELECT A/D (CS e0) ;BIT COUNTERw5 ;AwMUX ADDRESS ;CYwADDRESS BIT ;TEST BIT ;BITe0 ;DIw0 ;CONTINUE ;BITe1 ;DIw1 ;PULSE SK0 x1x0 ;CONTINUE UNTIL DONE ;EXTRA CLOCK FOR SYNC ;BIT COUNTERw8 ;PULSE SK0 x1x0 ;CYwDO ;AwRESULT ;A(0)wBIT AND SHIFT ;CwRESULT ;CONTINUE UNTIL DONE ;PULSE SUBROUTINE ;SKw1 ;DELAY ;SKw0 17 Applications (Continued) A ``Stand-Alone'' Hook-Up for ADC0838 Evaluation *Pinouts shown for ADC0838. For all other products tie to pin functions as shown. Low-Cost Remote Temperature Sensor TL/H/5583 ±14 18 Applications (Continued) Digitizing a Current Flow TL/H/5583 ±15 Operating with Ratiometric Transducers TL/H/5583 ±37 *VIN(b) e 0.15 VCC 15% of VCC s VXDR s 85% of VCC 19 Applications (Continued) Span Adjust: OVsVINs3V Zero-Shift and Span Adjust: 2V sVINs5V TL/H/5583 ±16 20 Applications (Continued) Obtaining Higher Resolution TL/H/5583 ±17 Controller performs a routine to determine which input polarity (9-bit example) or which channel pair (10-bit example) provides a non-zero output code. This information provides the extra bits. a) 9-Bit A/D b)10-Bit A/D Protecting the Input Diodes are 1N914 TL/H/5583 ±18 21 Applications (Continued) High Accuracy Comparators DO e all 1s if aVIN lbVIN DO e all 0s if aVIN kbVIN TL/H/5583 ±38 Digital Load Cell TL/H/5583 ±19 # Uses one more wire than load cell itself # Two mini-DIPs could be mounted inside load cell for digital output transducer # Electronic offset and gain trims relax mechanical specs for gauge factor and offset # Low level cell output is converted immediately for high noise immunity 22 Applications (Continued) 4mA±20 mACurrent Loop Converter # All power supplied by loop # 1500V isolation at output TL/H/5583 ± 20 Isolated Data Converter #No power required remotely #1500V isolation TL/H/5583 ±39 23 Applications (Continued) TL/H/5583 ± 21 TwoWire Interface for 8Channels TL/H/5583 ± 21 TwoWire Interface for 8Channels 24 Applications (Continued) Two Wire 1-Channel Interface TL/H/5583 ± 22 Ordering Information Part Number Analog Input Total Package Temperature Channels Unadjusted Error Range ADC0831BCJ 1 g(/2 Hermetic (J) b40§Cto a85§C ADC0831BCN Molded (N) 0§Cto a70§C ADC0831CCJ g1 Hermetic (J) b40§Cto a85§C ADC0831CCN Molded (N) 0§Cto a70§C ADC0831CIWM SO(M) b40§Cto a85§C ADC0831CCWM SO(M) 0§Cto a70§C ADC0832BIWM 2 g(/2 SO(M) b40§Cto a85§C ADC0832BCN Molded (N) 0§Cto a70§C ADC0832CIWM g1 SO(M) b40§Cto a85§C ADC0832CCN Molded (N) 0§Cto a70§C ADC0832CCWM SO(M) 0§Cto a70§C TL/H/5583 ± 22 Ordering Information Part Number Analog Input Total Package Temperature Channels Unadjusted Error Range ADC0831BCJ 1 g(/2 Hermetic (J) b40§Cto a85§C ADC0831BCN Molded (N) 0§Cto a70§C ADC0831CCJ g1 Hermetic (J) b40§Cto a85§C ADC0831CCN Molded (N) 0§Cto a70§C ADC0831CIWM SO(M) b40§Cto a85§C ADC0831CCWM SO(M) 0§Cto a70§C ADC0832BIWM 2 g(/2 SO(M) b40§Cto a85§C ADC0832BCN Molded (N) 0§Cto a70§C ADC0832CIWM g1 SO(M) b40§Cto a85§C ADC0832CCN Molded (N) 0§Cto a70§C ADC0832CCWM SO(M) 0§Cto a70§C 25 Ordering Information (Continued) Analog Input Total TemperaturePart Number PackageChannels Unadjusted Error Range ADC0834BCN g(/2 Molded (N) 0§Cto a70§C ADC0834CCJ Hermetic (J) b40§Cto a85§C ADC0834CCN 4 g1 Molded (N) 0§Cto a70§C ADC0834CCWM SO(M) 0§Cto a70§C ADC0834CIWM SO(M) b40§Cto a85§C ADC0838BCJ Hermetic (J) b40§Cto a85§C ADC0838BCV g(/2 PCC (V) 0§Cto a70§C ADC0838BCN Molded (N) 0§Cto a70§C ADC0838CCJ 8 Hermetic (J) b40§Cto a85§C ADC0838CCV PCC (V) 0§Cto a70§C ADC0838CCN g1 Molded (N) 0§Cto a70§C ADC0838CIWM SO(M) b40§Cto a85§C ADC0838CCWM SO(M) 0§Cto a70§C See NS Package Number J08A, J14A, J20A, M14B, M20B, N08E, N14A, N20A or V20A 26 27 Physical Dimensions inches (millimeters) Ceramic Dual-In-Line Package (J) NS Package Number J08A Ceramic Dual-In-Line Package (J) NS Package Number J14A Ceramic Dual-In-Line Package (J) NS Package Number J08A Ceramic Dual-In-Line Package (J) NS Package Number J14A 28 Physical Dimensions inches (millimeters) (Continued) Ceramic Dual-In-Line Package (J) NS Package Number J20A Hermetic Dual-In-Line Package (M) NS Package Number M14B Ceramic Dual-In-Line Package (J) NS Package Number J20A Hermetic Dual-In-Line Package (M) NS Package Number M14B 29 Physical Dimensions inches (millimeters) (Continued) Hermetic Dual-In-Line Package (M) NS Package Number M20B Molded Dual-In-Line Package (N) NS Package Number N08E Hermetic Dual-In-Line Package (M) NS Package Number M20B Molded Dual-In-Line Package (N) NS Package Number N08E 30 Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) NS Package Number N14A Molded-Dual-In-Line Package (N) NS Package Number N20A Molded Dual-In-Line Package (N) NS Package Number N14A Molded-Dual-In-Line Package (N) NS Package Number N20A 31 ADC0831/ADC0832/ADC0834andADC08388-Bit SerialI/OA/DConverterswith MultiplexerOptions Physical Dimensions inches (millimeters) (Continued) Molded Chip Carrier Package (V) Order Number ADC0838BCV or ADC0838CCV NS Package Number V20A LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd. 1111 West Bardin Road Fax: (a49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309 Arlington, TX 76017 Email: cnjwge @tevm2.nsc.com Ocean Centre, 5 Canton Rd. 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